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#ASX Announcements
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Added 2 years ago

4DS has announced that they have raised $2.5 million via a Placement of approximately 52 million shares at an issue price of $0.048 per share. 4DS is also intending to raise up to $2.5 million under a SPP, with the option to accept up to a further $1 million worth of oversubscriptions. They are proposing to use the money to advance the development of 4DS’ Interface Switching ReRAM technology with imec in 2022.

4DS shares are currently trading at 0.052 cents per share, down 11.86% this morning.

#ASX Announcements
stale
Added 3 years ago

4DS GRANTED 31st USA PATENT

4DS Memory Limited (ASX:4DS) (4DS) (the Company), is pleased to announce the granting of an additional USA patent bringing the Company’s portfolio of granted USA patents to thirty-one (31).

Details of the USA patent grant are as follows:

Resistive memory device having a template layer - Patent Number 11,043,633

All thirty-one granted patents are 100% owned by 4DS having been developed in-house and are free from any royalty and or licensing obligations.

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#ASX Announcements
stale
Added 3 years ago

4DS RECEIVES IMEC WAFERS

4DS Memory Limited (ASX:4DS) (4DS or the Company) today announced it has received two sets of wafers from imec.

Second Platform Lot

As previously advised during the quarter imec were finalising the production of the Second Platform Lot and 4DS is pleased to advise eighteen (18) wafers have now been received at its Fremont facilities.

Third Non-Platform Lot

The Company also took the opportunity to utilise spare capacity on imec state-of-the-art commercial production equipment to manufacture a Third Non-Platform Lot comprising of twenty-three (23) wafers. This decision was undertaken to ensure the Company continues to build an extensive data set around the process parameters for its Interface Switching ReRAM technology.

Analysis Commenced

Extensive and time-consuming analysis of both sets of wafers is currently underway and 4DS will report the results of both once they have been finalised between imec and 4DS.

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#ASX Announcements
stale
Added 3 years ago

HGST RENEWS FOR 8TH CONSECUTIVE YEAR

4DS Memory Limited (ASX:4DS) (4DS or the Company) today announced that HGST, a subsidiary of Western Digital Corporation, requested and has now signed the 8th consecutive twelve (12) month renewal of its joint development agreement (JDA) (Agreement) with 4DS well ahead of the 30 June 2021 renewal date.

Commenting on the renewal of the JDA, Chief Executive Officer and Managing Director, Dr Guido Arnout said, “We are very pleased that Western Digital and HGST have renewed our joint development agreement following a review of our significant progress during the past twelve months. This progress includes the Second Platform Lot currently in the final fabrication stage at imec that we will receive in early June for analysis.”

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#ASX Announcements
stale
Added 3 years ago

2021 IMEC COLLABORATION UPDATE 4DS

Memory Limited (ASX:4DS) (4DS or the Company) is pleased to provide an update on the 2021 imec collaboration extension and manufacturing of the Second Platform Lot wafers.

2021 imec collaboration extension

4DS and imec have now finalised the terms of the 2021 collaboration extension. The extension is for twelve months with an expiry date of 31 December 2021 and the terms remain confidential to both parties but are in line with the terms of the 2020 extension.

imec manufacture of Second Platform Lot

As stated in the ASX announcement dated 1 February 2021 the production of the Second Platform Lot commenced at imec in Belgium on 27 January 2021 and it continues to proceed as planned. The Company expects to analyse these wafers in Q2 of 2021 with results being available in the same quarter.

4DS’ Managing Director, Dr Guido Arnout stated that “We are pleased imec continue to believe in the potential of 4DS’s technology by their willingness to extend the collaboration for another year. We have already started the manufacture of the Second Platform Lot on imec production equipment, the same production equipment that any potential industry suitor for 4DS uses. Barring any unforeseen equipment failure, we expect to have results available in Q2 2021.”

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#ASX Announcements
stale
Added 3 years ago

4DS GRANTED 28th USA PATENT

4DS Memory Limited (ASX:4DS) (4DS) (the Company), having been advised by the Company’s USA patent attorney, is pleased to announce the granting of an additional USA patent bringing the Company’s portfolio of granted USA patents to twenty eight (28).

Details of the USA patent grant are as follows:

Resistive Memory Device Having A Template Layer - Patent No. 10,847,717.

Importantly all granted patents and applications are 100% owned by 4DS having been developed in-house and are free from any royalty and or licensing obligations.

The Company has filed an additional four (4) USA patent applications to protect its stream of internal innovations and to strengthen its intellectual property portfolio in the area of Interface Switching ReRAM for Storage Class Memory near to DRAM.

Chief Executive Officer and Managing Director Dr Guido Arnout stated “4DS, with 28 granted patents, has ring fenced its Interface Switching ReRAM technology with an extremely broad and defendable intellectual property position. We continue to file new patents around internal innovations and the speed for which some patents are going to grant via a fast track approval process is testament to the uniqueness of 4DS’ technology in the ReRAM field. A portfolio of granted patents is strategically significant as we move into 2021.”

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#ASX Announcements
stale
Added 4 years ago

Company Update

Key Points

  • Meetings with 4DS, imec and HGST have set the development plan for the next six months
  • Development plan potentially delivers a megabit chip and/or a corporate transaction in 2021
  • Following the successful $7.6 million Placement and SPP, the Company is fully funded to implement its strategy

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